IEC 61189-2-721-2015 PDF

Full title and description

Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 2‑721: Test methods for materials for interconnection structures — Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator. This standard specifies a procedure using a split‑post dielectric resonator (SPDR) to determine the relative permittivity (εr, also Dk) and loss tangent (tan δ, also Df) of copper‑clad laminates and dielectric base materials in the microwave range.

Abstract

IEC 61189‑2‑721:2015 describes an SPDR‑based test method for measurement of dielectric constant and dissipation factor of copper‑clad laminates and related dielectric substrates at microwave frequencies (nominally covering roughly 1.1 GHz up to about 20 GHz). The document covers sample requirements, resonator coupling and mounting, measurement procedure, calculation of εr and tan δ from resonant frequency and quality‑factor data, and guidance on uncertainty and reporting of results.

General information

• Status: Published.
• Publication date: 29 April 2015 (Edition 1.0).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.180 — Printed circuits and boards.
• Edition / version: Edition 1.0 (2015).
• Number of pages: 44 (IEC published PDF length).

Scope

This part of IEC 61189 defines a repeatable laboratory method for measuring the relative permittivity and loss tangent of copper‑clad laminates and their dielectric base materials at microwave frequencies using a split‑post dielectric resonator. It is intended for material qualification, comparative material data, and laboratory characterization of substrates in the frequency region typically used for high‑speed and microwave printed‑circuit applications. The method addresses sample preparation, resonator coupling, frequency and Q‑factor measurement, data reduction and uncertainty considerations.

Key topics and requirements

• Measurement of relative permittivity (εr / Dk) and loss tangent (tan δ / Df) for copper‑clad laminates using an SPDR.
• Frequency applicability across the microwave band (nominally ~1.1 GHz to 20 GHz) and guidance on resonator selection and coupling for that range.
• Sample geometry, handling and preparation requirements to ensure valid coupling to the resonator.
• Procedures for measuring resonant frequency and unloaded quality factor (Q0), and formulas to convert those measurements to dielectric parameters.
• Calibration, correction for metal cladding and flange/sample interactions, and treatment of measurement uncertainty and repeatability.
• Reporting requirements: test conditions, measurement apparatus description, results with uncertainty, and relevant environmental conditions.

Typical use and users

Used by materials laboratories, PCB laminate manufacturers, independent test laboratories, electronic‑packaging engineers, R&D teams evaluating substrate materials for high‑speed or microwave applications, and quality assurance organizations that need standardized dielectric data for design and material acceptance.

Related standards

Part of the IEC 61189 series of test methods for electrical materials, printed boards and other interconnection structures; other parts of IEC 61189 describe alternative dielectric test methods, mechanical and thermal tests, and test methods for assemblies. This method is commonly used alongside manufacturer specifications and traceable calibration procedures described in related IEC and ISO metrology documents.

Keywords

IEC 61189, split‑post dielectric resonator, SPDR, relative permittivity, dielectric constant, loss tangent, dissipation factor, copper‑clad laminate, microwave measurement, printed circuit substrate, TC 91.

FAQ

Q: What is this standard?

A: IEC 61189‑2‑721:2015 is an international test method standard that defines how to measure the relative permittivity and loss tangent of copper‑clad laminates at microwave frequencies using a split‑post dielectric resonator (SPDR).

Q: What does it cover?

A: It covers sample preparation, resonator setup and coupling, measurement of resonant frequency and Q‑factor, data reduction to obtain εr and tan δ, calibration/correction notes (including treatment of metal cladding), uncertainty estimation and reporting of results for frequencies typically in the ~1.1–20 GHz range.

Q: Who typically uses it?

A: PCB laminate manufacturers, materials suppliers, test laboratories, design engineers working on high‑speed or RF/microwave circuits, and quality/qualification teams who require standardized dielectric property measurements for material selection and specification.

Q: Is it current or superseded?

A: IEC 61189‑2‑721 was published in April 2015 (Edition 1.0) and is listed as a published international standard; users should confirm any national adoptions or amendments and check the IEC catalogue or their national standards body for updates or planned revisions.

Q: Is it part of a series?

A: Yes — it is one part of the IEC 61189 series (test methods for electrical materials, printed boards and other interconnection structures and assemblies), maintained by IEC TC 91 (Electronics assembly technology).

Q: What are the key keywords?

A: Split‑post dielectric resonator, SPDR, permittivity, loss tangent, dielectric constant, dissipation factor, copper‑clad laminate, microwave, PCB substrate, IEC 61189.