IEC 61189-3-2007 PDF

Full title and description

Test methods for electrical materials, printed boards and other interconnection structures and assemblies — Part 3: Test methods for interconnection structures (printed boards). This IEC standard is a catalogue of standardized test methods (visual, dimensional, chemical, mechanical, electrical, environmental and miscellaneous) for materials and assemblies used to manufacture printed boards and other interconnection structures.

Abstract

IEC 61189-3:2007 (Edition 2.0) provides detailed, repeatable procedures, specimen definitions and reporting requirements for a broad set of test methods applicable to printed boards (PCBs) and related interconnection structures. The 2007 edition expanded the catalogue with approximately 25 additional tests across visual, dimensional, chemical, mechanical, electrical and environmental categories to address evolving industry needs.

General information

• Status: Published / Active (Edition 2.0).
• Publication date: 9 October 2007 (IEC publication date shown as 2007‑10‑09).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.180 — Printed circuits and boards.
• Edition / version: Edition 2.0 (2007).
• Number of pages: 241 pages (bilingual English/French published form); English-only pagination is reported separately (about 118 pages depending on format).

Scope

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It defines specimen preparation, apparatus, detailed procedures, conditioning and reporting requirements for each method and groups methods into functional categories (P — preparation/conditioning; V — visual; D — dimensional; C — chemical; M — mechanical; E — electrical; N — environmental; X — miscellaneous). The 2007 edition adds multiple new sectional test methods to address industry developments.

Key topics and requirements

• Catalogue of standardized test methods for printed boards and interconnection structures (visual inspection at defined magnifications, dimensional checks, chemical analyses, mechanical strength and peel tests, electrical continuity/insulation and contact tests, environmental stress tests, and miscellaneous procedures).
• Detailed specimen definitions, conditioning and preparation procedures to ensure repeatability and comparability of results.
• Defined apparatus and measurement uncertainty / calibration guidance to support traceable measurements.
• Reporting requirements specifying method number, specimen identification, test conditions, magnifications (for visual methods), deviations and results.
• Annexes and worked examples, diagrams of fixtures and sample test coupons to aid implementation.

Typical use and users

Used by PCB designers and manufacturers, contract assembly houses, independent test laboratories, quality and reliability engineers, materials suppliers and R&D teams to specify, perform and report standardized tests for PCB materials and interconnection structures. Laboratories adopt the procedures to demonstrate product compliance, qualify materials/processes and perform failure analysis.

Related standards

IEC 61189-3 is part of the broader IEC 61189 series (other parts, subparts and technical reports address additional test techniques and special topics). Related standards and documents in the PCB and assembly domain include other parts of IEC 61189, IEC 61190 (soldering fluxes and materials), IEC 61191 (surface mounting), and numerous TS/TR/FDIS/documents and newer subparts (for example IEC 61189-3-302:2025 covering CT detection of plating defects). These related parts provide complementary methods, test coupons and guidance for specific technologies and test technologies.

Keywords

IEC 61189-3, test methods, printed boards, PCBs, interconnection structures, visual inspection, dimensional measurement, chemical analysis, mechanical testing, electrical testing, environmental testing, solderability, glow-wire test, test coupons, TC 91.

FAQ

Q: What is this standard?

A: IEC 61189-3:2007 is the IEC catalogue of standardized test methods for interconnection structures (printed boards), providing detailed procedures for testing materials and assemblies used in PCB manufacture and assembly.

Q: What does it cover?

A: It covers specimen preparation, apparatus, procedures, conditioning and reporting for a wide range of tests (visual, dimensional, chemical, mechanical, electrical, environmental and miscellaneous) specifically targeted at printed boards and interconnection structures. The 2007 edition added around 25 new sectional test methods.

Q: Who typically uses it?

A: PCB manufacturers, contract assemblers, independent test labs, quality/reliability engineers, materials suppliers and R&D groups use the standard to specify and perform repeatable, comparable tests for qualification, acceptance and failure analysis.

Q: Is it current or superseded?

A: As of the current information, IEC 61189-3:2007 (Edition 2.0) remains the published edition of Part 3. IEC continues to produce related subparts and updates within the 61189 series (for example recent 61189-3-3xx subparts such as 61189-3-302:2025), so users should check for new subparts or technical specifications that add or refine methods. IEC’s webstore shows the 2007 edition as active with a stability date noted in the publisher record. If you need absolute current legal status for procurement or regulatory compliance, verify the IEC webstore or your national standards body before purchase or formal citation.

Q: Is it part of a series?

A: Yes — IEC 61189 is a multi-part series covering test methods for electrical materials, printed boards and other interconnection structures and assemblies; Part 3 is focused on interconnection structures (printed boards) and has several subparts, amendments and related TR/TS documents.

Q: What are the key keywords?

A: Test methods, printed boards, interconnection structures, PCB testing, visual inspection, dimensional measurement, chemical tests, mechanical tests, electrical tests, environmental tests, solderability, glow-wire.