IEC TS 61967-3-2014 PDF

Full title and description

Integrated circuits — Measurement of electromagnetic emissions — Part 3: Measurement of radiated emissions — Surface scan method. This IEC Technical Specification defines a near-field surface-scan measurement procedure to evaluate electric, magnetic and electromagnetic field components at or near the surface of an integrated circuit (IC) for diagnostic and architectural analysis such as floor‑planning and power‑distribution optimisation.

Abstract

This technical specification (IEC TS 61967-3:2014, Edition 2.0) specifies a method to map near‑field radiated emissions from an IC mounted on a circuit board using scanning probes. It covers test equipment, probe calibration, test setup and probe‑positioning systems, measurement and post‑processing of data (frequency‑ or time‑domain) and data‑exchange provisions. The method is intended for use up to 6 GHz (extension beyond 6 GHz is possible with probe technology but is outside the scope).

General information

• Status: Technical Specification (IEC TS), active/stable publication.
• Publication date: 25 August 2014.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.200 (Electromagnetic compatibility).
• Edition / version: Edition 2.0 (2014).
• Number of pages: 73 pages.

Scope

IEC TS 61967-3:2014 defines a diagnostic measurement procedure to evaluate near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit mounted on a circuit board that is accessible to a scanning probe. The procedure is intended for IC architectural and EMC analysis (for example, floor‑planning and power‑distribution network optimisation), and for identifying emission regions that could affect nearby devices. For repeatable comparison between ICs, the standardized test board defined in IEC 61967‑1 is recommended. The specification addresses test conditions, equipment, probe calibration, test technique, measurement data, post‑processing and data exchange. The method is intended for use up to 6 GHz.

Key topics and requirements

• Near‑field surface mapping of electric (E) and magnetic (H) field components over an IC.
• Probe types and characteristics (discrete E or H probes and combined E/H probes) and the effect of probe resolution on spatial measurement accuracy.
• Calibration of near‑field probes and a normative annex detailing calibration procedures.
• Test setup requirements: shielding, RF measuring instruments, preamplifiers, cabling, probe‑positioning systems and software.
• Measurement procedures: ambient/test conditions, operational checks, scanning technique (frequency‑ or time‑domain) and data acquisition.
• Post‑processing, measurement data handling and recommended data‑exchange formats for interoperability.
• Intended frequency usability up to 6 GHz (extensions possible with suitable probe technology but not covered by the TS).

Typical use and users

Primary users are IC design teams, EMC/EMI engineers, test and measurement laboratories, semiconductor device manufacturers and R&D groups. Typical uses include locating and diagnosing radiating structures on dies and packages, guiding floor‑planning and power‑distribution improvements, validating emission‑reduction measures, and producing repeatable near‑field emission maps for design comparison or failure analysis.

Related standards

IEC TS 61967-3 is part of the IEC 61967 series addressing electromagnetic emission measurement for integrated circuits. Key related documents include IEC 61967‑1 (General conditions and definitions, recommended standardized test board) and other parts of the series covering conducted emissions (for example Part 4). Users commonly consult IEC 61967‑1 alongside Part 3 for test board definitions and general conditions.

Keywords

integrated circuits; radiated emissions; near‑field scanning; surface scan method; EMC; EMI; probe calibration; probe positioning; post‑processing; data exchange; 6 GHz; test board; IC diagnostics.

FAQ

Q: What is this standard?

A: IEC TS 61967-3:2014 is an IEC Technical Specification that specifies a surface‑scan method for measuring near‑field radiated emissions from integrated circuits to support diagnostic and architectural analysis.

Q: What does it cover?

A: It covers test conditions, required test equipment (probes, RF instruments, shielding), probe calibration (normative annex), probe‑positioning systems, measurement procedures (frequency‑ or time‑domain), data post‑processing and data exchange. The method is intended for use up to 6 GHz.

Q: Who typically uses it?

A: IC designers, EMC engineers, semiconductor manufacturers, test laboratories and research teams use it to map and diagnose emission sources on chips and packages and to guide design changes that reduce radiated emissions.

Q: Is it current or superseded?

A: IEC TS 61967-3:2014 is Edition 2.0 published 25 August 2014 and is published as a stable TS; its IEC record lists a stability/planned review date (stability) — it remains the valid Technical Specification as published in 2014. Users should check the IEC catalogue for any later amendments or replacements when making regulatory or compliance decisions.

Q: Is it part of a series?

A: Yes — it is part of the IEC 61967 series (measurement of electromagnetic emissions from integrated circuits). Other parts include IEC 61967‑1 (general conditions and definitions) and parts addressing conducted emissions (for example Part 4).

Q: What are the key keywords?

A: Integrated circuits, radiated emissions, near‑field scanning, surface scan, EMC/EMI, probe calibration, probe positioning, test board, data exchange, 6 GHz.