IEC TS 62647-4-2018 PDF

Full title and description

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling. This IEC Technical Specification defines administrative and technical requirements for replacing solder balls on BGA component packages as part of an electronic components management plan (ECMP) for aerospace, defence and other high-reliability systems.

Abstract

IEC TS 62647-4:2018 gives re-balling providers (companies that replace BGA solder balls) the process, documentation and quality requirements needed to incorporate BGA re-balling into existing repair/manufacturing operations or to establish a stand‑alone re-balling process for avionics and defence applications. The specification addresses process control, materials and equipment control, traceability, inspection and acceptance criteria, and requirements for demonstrating conformity within an ECMP.

General information

• Status: Published / Active Technical Specification.
• Publication date: 10 April 2018 (IEC publication date shown as 2018-04-10).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 03.100.50; 31.020; 49.060 (Production/production management; Electronic components; Aerospace electric equipment and systems).
• Edition / version: Edition 1.0 (Ed. 1.0, 2018).
• Number of pages: 41 pages (official IEC webstore listing).

Scope

Defines requirements for replacing solder balls on ball grid array (BGA) packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high‑reliability products. The scope covers administrative controls, technical process specifications (re-balling steps and controls), materials and equipment management, traceability, inspection and testing, documentation and declaration of conformity appropriate for avionics/defence applications. The document is intended for incorporation into existing repair or manufacturing quality systems or for establishing a dedicated re‑balling process.

Key topics and requirements

• Administrative and contractual requirements for re-balling providers (roles, responsibilities, declarations of conformity and customer communication).
• Quality management and documentation: integration with an internationally recognized quality system (for example AS/EN/JISQ 9100 or equivalent where applicable), process documentation, non‑conformance and corrective actions, and configuration control.
• Materials, fluxes and solder ball specification, handling and storage controls to preserve component integrity and cleanliness.
• Process controls for re-balling: pre‑rework inspection, ball removal, pad restoration, ball placement, reflow criteria, and post‑reflow inspection and testing.
• Traceability and record keeping: part identification, process lot records, equipment calibration and maintenance, material lot tracking and return/replacement records.
• Inspection and acceptance criteria: visual and microscopic inspection, solder joint integrity checks and any required electrical or mechanical verification tests.
• Risk mitigation and special considerations for lead‑free solders in aerospace/defence environments (contamination control, deleterious tin effects and reliability considerations).

Typical use and users

This Technical Specification is used by companies that perform BGA re‑balling, repair and refurbishment houses supporting aerospace and defence electronics, OEM and subcontractor quality and R&D teams, procurement and quality managers who manage ECMPs, and regulatory/compliance personnel responsible for ensuring high‑reliability soldering practices. It is also referenced by engineering teams specifying repair requirements and by auditors evaluating conformance of rework suppliers.

Related standards

IEC TS 62647-4 is part of the 62647 series addressing process management for avionics and lead‑free soldered systems; related documents and referenced standards commonly used with this TS include IEC TS 62647-1, IEC TS 62647-2, IEC TS 62647-3 and IEC TS 62668 series, plus industry and component-handling standards such as JEDEC and IPC documents (examples: JEDEC JESD625, IPC J-STD series), MIL and aerospace specifications (MIL-STD‑883, AS/EN/JISQ 9100) and IEC 62239‑1. For a consolidated list of cross‑references typically associated with this TS, consult vendor/standards stores and normative references in the TS.

Keywords

BGA re-balling; ball grid array; rework; re-balling provider; electronics repair; lead-free solder; avionics; defence electronics; ECMP; process management; traceability; solder joint inspection; quality management.

FAQ

Q: What is this standard?

A: IEC TS 62647-4:2018 is a Technical Specification that sets out process, administrative and technical requirements for replacing solder balls on ball grid array (BGA) component packages used in aerospace, defence and high‑reliability electronic systems.

Q: What does it cover?

A: It covers the scope and controls for BGA re‑balling activities within an electronic components management plan (ECMP), including process definition, materials and equipment control, inspection/acceptance criteria, documentation, traceability and conformance obligations for re‑balling providers.

Q: Who typically uses it?

A: Rework and refurbishment service providers (BGA re‑balling houses), aerospace/defence OEMs and subcontractors, quality and procurement teams managing supplier conformance, and engineers writing repair/maintenance specifications for high‑reliability electronics.

Q: Is it current or superseded?

A: As published on 10 April 2018, IEC TS 62647-4:2018 is the authoritative Edition 1.0 for this topic. The IEC webstore shows the publication details and a stability date indicating the expected lifecycle; users should check the IEC publications catalogue for any amendments or revisions after 2018 before relying on the text for compliance.

Q: Is it part of a series?

A: Yes — it is part of the IEC 62647 series (process management for avionics and lead‑free soldered systems). Companion parts address other aspects such as mitigation of deleterious tin effects and performance testing; consult the series index and normative references for the complete set.

Q: What are the key keywords?

A: Key keywords include: BGA re‑balling, ball grid array, rework, lead‑free solder, avionics, defence electronics, ECMP, process management, traceability, inspection, quality system.