IEC TS 62878-2-3-2015 PDF
Name in English:
St IEC TS 62878-2-3-2015
Name in Russian:
Ст IEC TS 62878-2-3-2015
Original standard IEC TS 62878-2-3-2015 in PDF full version. Additional info + preview on request
Full title and description
IEC TS 62878-2-3:2015 — Device embedded substrate — Part 2-3: Guidelines — Design guide. A technical specification providing design guidance for device-embedded substrates (substrates with integrated active or passive devices), covering principles of circuit and structure design, board design, manufacturing and assembly (jisso) processes, and test considerations for substrates fabricated from organic base materials.
Abstract
This Technical Specification gives a design guide for device embedded substrates, describing best practices and guidelines for circuit design, structural and board design, manufacturing and assembly process considerations, and relevant test approaches. It is intended to enable consistent understanding and application of design principles for substrates that include embedded active or passive components or discrete elements formed during printed wiring board fabrication.
General information
- Status: Published Technical Specification (IEC TS).
- Publication date: 27 March 2015.
- Publisher: International Electrotechnical Commission (IEC), TC 91 — Electronics assembly technology.
- ICS / categories: 31.180 (Printed circuits and boards); 31.190 (Electronic component assemblies).
- Edition / version: Edition 1.0 (2015).
- Number of pages: 50 (bilingual English/French edition).
Scope
The document provides design guidelines applicable to device embedded substrates fabricated using organic base materials. It addresses embedded active and passive devices, discrete components formed during printed wiring board fabrication, and thin-sheet formed components. The guidance covers circuit-level considerations, structural design, board layout, manufacturing and assembly (jisso) process interactions, and test considerations. The specification focuses on design and guideline material rather than normative test methods; it does not apply to redistribution layers (RDL) or certain electronic module types covered under other IEC documents.
Key topics and requirements
- Design principles for embedding active and passive devices in printed wiring substrates.
- Board structure and material selection guidance for organic-base device-embedded substrates.
- Layout and routing considerations specific to embedded components and multilayer boards.
- Manufacturing and assembly (jisso) process interactions and design-for-manufacture recommendations.
- Recommended test and inspection approaches relevant to embedded-device substrates.
- Compatibility considerations with existing PCB processes and constraints on applicable technologies (e.g., RDL exclusions).
Typical use and users
Engineers and designers of printed circuit boards and device-embedded substrates, process and manufacturing engineers in electronics assembly, quality and test engineers, and standards or compliance professionals will use this specification as a practical guide when developing substrates with embedded components. It is also useful for R&D teams exploring embedded-device integration and for suppliers of substrate materials and contract manufacturers adapting processes to embedded-device designs.
Related standards
Related IEC and referenced documents typically include other parts of the IEC 62878 series (Part 1 and other Part 2 guidance), IEC 62421 (for module and related definitions), and standards covering printed wiring board materials and test methods such as IEC 61189, IEC 61249 and IEC 60194. Users should consult the IEC 62878 series and the normative references listed in the specification for full context.
Keywords
Device embedded substrate, embedded components, design guide, printed wiring board, PCB, jisso, assembly, manufacturing, test element groups, organic base material, embedded passive, embedded active.
FAQ
Q: What is this standard?
A: IEC TS 62878-2-3:2015 is a Technical Specification titled "Device embedded substrate — Part 2-3: Guidelines — Design guide" that provides practical design guidance for substrates with embedded devices.
Q: What does it cover?
A: It covers design principles for circuit and structure, board layout, material selection, manufacturing and assembly (jisso) interactions, and test/inspection considerations for device-embedded substrates made from organic base materials.
Q: Who typically uses it?
A: PCB and substrate designers, electronics assembly and process engineers, test/quality engineers, suppliers, and R&D teams working on embedded-device integration.
Q: Is it current or superseded?
A: Published on 27 March 2015 as Edition 1.0. It is a published IEC Technical Specification; users should verify the current status before purchase or application (check with the IEC or your national standards body for any amendments or later revisions).
Q: Is it part of a series?
A: Yes — it is part of the IEC 62878 series on device embedded substrates; related parts include other Part 2 documents and Part 1 entries that address definitions, general principles and complementary guidelines.
Q: What are the key keywords?
A: Device embedded substrate, embedded component, PCB design, assembly (jisso), organic base material, design guide, test and inspection.