IPC 7352-2023 PDF

Full title and description

IPC-7352 — Generic Guideline for Land Pattern Design (2023). This IPC guideline provides recommended land‑pattern geometries, naming conventions and producibility/density level guidance to help PCB designers and ECAD library authors create reliable surface‑mount footprints and solderable pad layouts for a wide range of components (discrete, array and bottom‑termination types).

Abstract

IPC-7352 is a focused guideline that establishes recommended pad shapes, fillet and courtyard allowances, solder mask and stencil considerations, and naming conventions for land patterns used in surface‑mount assembly. It complements IPC‑7351 and other IPC land‑pattern documents by providing generic, practical guidance designers can apply when creating ECAD library footprints to meet manufacturability, inspection and rework needs.

General information

• Status: Active / Current.
• Publication date: 01 May 2023 (2023 edition, Revision 0).
• Publisher: IPC (Association Connecting Electronics Industries / IPC International).
• ICS / categories: Electronics and printed boards (relevant ICS areas include 31.020 / 31.180 — electronics, printed boards and assemblies).
• Edition / version: 2023 edition (standard release May 2023, Revision 0).
• Number of pages: 56 pages.

Scope

The standard provides generic guidelines for land pattern geometries used to attach electronic components to printed boards, including guidance on pad geometry, land protrusion (solder fillet allowances), courtyard and keep‑out areas, solder mask and paste aperture considerations, producibility and density levels, and ECAD naming conventions. It is intended for use across common assembly processes (primarily reflow) and should be adapted as needed for specific board technologies, soldering processes or environmental requirements.

Key topics and requirements

• Recommended pad/land geometries for common SMD families (chip parts, gull‑wing, J‑lead, bottom‑termination, array packages such as BGA/LGA).
• Density and producibility classifications (Level A / B / C style guidance to balance reliability and component density).
• Solder fillet / land protrusion recommendations to ensure adequate solder volume and inspection access.
• Solder mask, paste stencil aperture and courtyard/keep‑out guidance to support assembly, inspection and rework.
• ECAD library naming conventions and land‑pattern naming examples to standardize footprint management.
• Notes on process adaptation (wave vs. reflow, alternative alloys, thermal/heat‑dissipation considerations—users should adapt guidance where necessary).

Typical use and users

Primary users include PCB layout designers, ECAD library engineers, manufacturing/process engineers, DfM/DFX teams, contract manufacturers (CMs) and quality/reliability engineers. IPC‑7352 is used when creating or validating SMD footprints, preparing library releases, and when establishing corporate land‑pattern guidelines that must be repeatable across designs and suppliers.

Related standards

IPC‑7352 is part of the IPC land‑pattern family and complements IPC‑7351 and other IPC‑735x documents; it also relates to IPC J‑STD‑001 (soldering requirements), IPC‑709x series (bottom‑termination and array components guidance, e.g., IPC‑7093/7095), and international IEC/EN documents for printed‑board land patterns (IEC 61188‑5‑x series). Users commonly reference these documents together when defining footprints and assembly requirements.

Keywords

land pattern; footprint; pad geometry; SMD; BGA; QFN; solder fillet; courtyard; ECAD library; density level; IPC‑7352; reflow soldering; solder mask; stencil aperture.

FAQ

Q: What is this standard?

A: IPC‑7352 is IPC’s Generic Guideline for Land Pattern Design (2023 edition) providing recommended land‑pattern geometries, naming conventions and producibility/density guidance for surface‑mount footprints.

Q: What does it cover?

A: It covers recommended pad shapes and sizes, solder fillet (land protrusion) guidance, courtyard and keep‑out definitions, solder mask and paste aperture considerations, ECAD naming conventions, and adaptation notes for different processes and component families.

Q: Who typically uses it?

A: PCB designers, ECAD library teams, manufacturing/process engineers, contract manufacturers and quality/reliability engineers use IPC‑7352 when creating, validating or standardizing SMD footprints for reliable assembly.

Q: Is it current or superseded?

A: As published on 01 May 2023 IPC‑7352 is the current (active) edition; users should check IPC’s official publications or IPC store for any amendments or later revisions after that date.

Q: Is it part of a series?

A: Yes — IPC‑7352 is part of the IPC‑735x family of land‑pattern documents and is used alongside IPC‑7351 and other sectional IPC‑735x parts as well as related IPC and IEC standards for PCB design and assembly.

Q: What are the key keywords?

A: Land pattern, footprint, pad geometry, SMD, BGA, QFN, solder fillet, courtyard, ECAD library, density level, IPC‑7352.