ISO 22290-2020 PDF

Full title and description

Non-destructive testing — Infrared thermographic testing — General principles for thermoelastic stress measuring method. This International Standard defines the general principles for using the thermoelastic stress measuring method (a thermoelastic stress analysis variant of infrared thermographic testing) as an industrial non‑destructive testing (NDT) technique for full‑field surface stress mapping of materials and structures.

Abstract

This document provides general principles of the thermoelastic stress measuring method of infrared thermographic testing, describing the method’s purpose, normative references, personnel considerations, measurement conditions and the essential elements needed for correct and effective application to industrial NDT (automotive, aerospace, electronics, medical devices, general materials testing and similar applications).

General information

• Status: Published
• Publication date: November 2020 (published 2020-11; bibliographic records show 16 November 2020).
• Publisher: International Organization for Standardization (ISO)
• ICS / categories: 19.100 — Non‑destructive testing
• Edition / version: Edition 1 (2020)
• Number of pages: 9 (ISO bibliographic record: 9 pages).

Bibliographic and status details as recorded in ISO catalogues and national standards distributors.

Scope

This International Standard provides the general principles for the thermoelastic stress measuring method used in infrared thermographic testing within industrial NDT. It covers terminology, normative references, basic personnel competence considerations, essential test conditions (for example cyclic loading and near‑adiabatic conditions), instrumentation characteristics and general guidance to promote correct and effective application of the method across a range of industrial uses. The document is intended to help practitioners apply thermoelastic stress analysis (TSA) reliably for full‑field surface stress measurements.

Key topics and requirements

• Fundamental thermoelastic principle: relation between cyclic stress changes and small temperature variations (thermoelastic effect) under appropriate loading and boundary conditions.
• Definitions and vocabulary consistent with ISO thermographic NDT terminology.
• Requirements and characteristics for thermographic systems and sensors used for TSA (detector sensitivity, frame rate, optics, calibration needs).
• Test setup and loading: cyclic or periodic loading strategies, reference signal acquisition and considerations for near‑adiabatic measurement conditions.
• Data acquisition and signal processing approaches (lock‑in / phase‑sensitive methods, correlation and component‑extraction techniques) and guidance on converting thermoelastic signals into relative stress maps.
• Limitations, measurement uncertainty factors, surface condition considerations and recommended good practices for effective application in industrial contexts.

Key topics summarized from the ISO standard and recent thermoelastic/TSA literature covering instrumentation and signal processing methods (lock‑in, SVD and other component‑extraction techniques).

Typical use and users

Typical users are NDT engineers, research and development teams, structural test laboratories, quality assurance groups in aerospace and automotive industries, materials laboratories, and specialized service providers offering thermoelastic stress analysis services. Typical uses include full‑field stress mapping under cyclic loads, validation of finite‑element models, fatigue and crack‑tip studies, residual stress investigations and in‑situ stress assessment of components and assemblies.

Related standards

Normative and related references commonly used alongside ISO 22290:2020 include ISO 10878 (Infrared thermography — Vocabulary), ISO 10880 (Characteristics of system and equipment) / ISO 18251‑1 (equipment characteristics), and ISO 9712 (qualification and certification of NDT personnel). The standard is produced within the ISO/TC 135 thermographic testing work programme and is intended to be used together with other ISO thermography guidance documents.

Keywords

thermoelastic stress measuring method; thermoelastic stress analysis (TSA); infrared thermography; lock‑in thermography; non‑destructive testing (NDT); full‑field stress mapping; thermoelastic effect; infrared NDT; stress imaging.

FAQ

Q: What is this standard?

A: ISO 22290:2020 is an International Standard titled "Non‑destructive testing — Infrared thermographic testing — General principles for thermoelastic stress measuring method." It gives general principles for applying thermoelastic stress measurement using infrared thermography in industrial NDT contexts.

Q: What does it cover?

A: It covers the principles, terminology, high‑level requirements for personnel and equipment, recommended test conditions (cyclic loading, near‑adiabatic assumptions), and guidance on data acquisition and signal processing needed to obtain reliable thermoelastic stress measurements. It is intended as overarching guidance rather than a detailed step‑by‑step procedure.

Q: Who typically uses it?

A: NDT practitioners, test engineers, R&D teams, labs performing stress and fatigue testing, and OEM quality teams in aerospace, automotive, electronics and other industries where full‑field stress mapping and non‑contact stress measurement are required.

Q: Is it current or superseded?

A: ISO 22290:2020 was published in November 2020 (Edition 1) and is recorded as published in ISO catalogues. Like all ISO standards it is subject to periodic systematic review (typically every five years); users should verify current status in the ISO catalogue for any subsequent amendments or revisions.

Q: Is it part of a series?

A: The standard sits within the family of ISO thermographic testing documents produced under ISO/TC 135 (thermographic testing) and is intended to be used alongside related ISO thermography standards (vocabulary, equipment characteristics and personnel qualification standards).

Q: What are the key keywords?

A: thermoelastic stress analysis (TSA), thermoelastic effect, infrared thermography, lock‑in thermography, non‑destructive testing (NDT), full‑field stress mapping, stress imaging, TSA signal processing.