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Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices by the wetting balance method using solder paste
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Information technology. Open systems interconnection. Structure of management information. Guidelines for the definition of managed objects
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Semiconductor diodes. Radiators. Methods for measurement of parameters. General principles
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Railway telecommunications. Safety requirement control methods
Document status: Cancelled
Micromodules of stacked and spaced construction. Measuring methods of electrical characteristics
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