STB PDF

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA). Original standard UNE-EN 60191-6-18-2010 in PDF full version. Additional info + preview on request

Document status: Active

Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage. Original standard UNE-EN 60191-6-19-2010 in PDF full version. Additional info + preview on request

Document status: Active

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP). Original standard UNE-EN 60191-6-21-2010 in PDF full version. Additional info + preview on request

Document status: Active

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA). Original standard UNE-EN 60191-6-4-2003 in PDF full version. Additional info + preview on request

Document status: Active

Method of measurement of current noise generated in fixed resistors. Original standard UNE-EN 60195-2016 in PDF full version. Additional info + preview on request

Document status: Active

Safety Electr Part 1. Original standard UNE-EN 60204-1-2007 (2010) in PDF full version. Additional info + preview on request

Document status: Replaced by STB UNE-EN 60204-1-2019