Belarus standards PDF
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. Original standard BS EN 60191-6-2-2002 (2003) in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ). Original standard BS EN 60191-6-20-2010 in PDF full version. Additional info + preview on request
Document status: Active
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Original standard BS EN 60191-6-2009 in PDF full version. Additional info + preview on request
Document status: Active
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP). Original standard BS EN 60191-6-21-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon. Original standard BS EN 60191-6-22-2013 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP). Original standard BS EN 60191-6-3-2001 in PDF full version. Additional info + preview on request
Document status: Active