IEC 61191-2-2017 PDF

Full title and description

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies. This International Standard specifies workmanship, joint and component requirements, and acceptance criteria for surface-mount soldered connections on printed board assemblies (including wholly surface-mounted assemblies and the surface-mounted portions of mixed-technology assemblies).

Abstract

IEC 61191-2:2017 defines detailed requirements for surface mount solder connections and related assembly features (lead forming, component positioning, fillet geometry, process control and inspection). The 2017 edition was revised to align acceptance criteria with IPC‑A‑610F, to update terminology and references, and to add several termination styles; the published copy includes the September 2019 corrigendum.

General information

• Status: International Standard — published and in-force (edition 3.0).
• Publication date: 23 May 2017.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.190; 31.240 (printed boards / electronic component assemblies).
• Edition / version: 3.0 (2017).
• Number of pages: 33 (PDF publication pages as listed by IEC).

Scope

This part of IEC 61191 establishes sectional specification requirements for soldered surface-mount assemblies: visual and dimensional acceptance criteria, joint geometry, component standoff and cant, lead forming rules, designated workmanship levels, and necessary process control and inspection provisions. It applies to assemblies that are wholly surface-mounted and to the surface-mounted portions of mixed-technology assemblies. The standard is intended to be used alongside the generic requirements of IEC 61191-1 and other relevant documents.

Key topics and requirements

• Workmanship classes and acceptance levels for soldered joints (including visual criteria consistent with IPC‑A‑610 acceptance guidance).
• Solder fillet geometry and minimum fillet/heel requirements for various lead and termination styles.
• Component positioning, maximum body stand‑off (cant) limits and land/lead relationships.
• Lead forming and handling guidance to avoid lead‑to‑body seal damage.
• Process control expectations and when Annex A (detailed requirements) is mandatory if process controls are not in place.
• Added termination styles and corrected normative references introduced in the 2017 edition (corrigendum included).

Typical use and users

Used by printed circuit board (PCB) assemblers, original equipment manufacturers (OEMs), contract manufacturers, quality and inspection engineers, procurement/specification authors, test laboratories and auditors to specify and verify acceptable surface-mount soldered assemblies and to drive process controls and acceptance testing in production and incoming inspection.

Related standards

Part of the IEC 61191 series (see IEC 61191-1 — Generic specification; IEC 61191-3 — Through‑hole mount assemblies; IEC 61191-4 — Terminal soldered assemblies). This part is often used in conjunction with IPC‑A‑610 (acceptance criteria for electronic assemblies) and with applicable national adoptions (EN/BS/ISO adoptions and translated editions).

Keywords

surface mount, soldered assemblies, printed board assemblies, workmanship, solder fillet, lead forming, IPC-A-610, acceptance criteria, reflow soldering, component positioning

FAQ

Q: What is this standard?

A: IEC 61191-2:2017 is an international sectional specification that sets workmanship, joint and acceptance requirements for surface-mount soldered printed board assemblies.

Q: What does it cover?

A: It covers visual and dimensional acceptance criteria for surface-mount solder joints, component and lead requirements (positioning, cant and stand‑off), solder fillet geometry, termination styles, and process control/inspection guidance. The 2017 edition updated references and acceptance alignment with IPC‑A‑610 and includes a 2019 corrigendum.

Q: Who typically uses it?

A: PCB assemblers, contract manufacturers, QA/inspection personnel, procurement/specification writers, and test labs use it to define and verify acceptable surface-mount soldered assemblies.

Q: Is it current or superseded?

A: The 2017 third edition (with the September 2019 corrigendum incorporated) is the published edition; the IEC webstore lists stability through 2026 for this edition. Users should verify any later amendments or a newer edition with the IEC webstore or their national standards body before citing a standard for contractual requirements.

Q: Is it part of a series?

A: Yes — IEC 61191 is a multi‑part series for printed board assemblies; Part 1 is the generic specification and other parts (3, 4, etc.) cover through‑hole and terminal assemblies respectively. This part (‑2) is the sectional specification for surface‑mount assemblies.

Q: What are the key keywords?

A: Surface mount, soldered assemblies, workmanship, solder fillet, reflow soldering, IPC-A-610, component positioning, lead forming.