IEC 61760-2-2021 PDF

Full title and description

IEC 61760-2:2021 — Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide. This document specifies recommended transportation, packing and storage conditions to ensure SMDs (active and passive) arrive and are stored in a condition suitable for trouble‑free processing (placement, soldering and subsequent assembly) and to minimize defects such as poor solderability, delamination and "popcorning".

Abstract

Application guide giving recommended environmental, mechanical and packaging requirements for the transport and storage of surface mounting devices (SMDs). It explains general protection principles, specific handling and packaging practices (including dry packing where applicable), and cross‑references normative documents for moisture‑sensitive device handling and packaging. The guidance is intended to reduce processing failures caused by improper transport or storage.

General information

• Status: Published / Current (active international standard).
• Publication date: 16 July 2021 (Edition 3.0 / 2021 release).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.240 (Mechanical structures for electronic equipment).
• Edition / version: Edition 3.0 (2021). Redline (RLV) version is also published showing changes to the previous edition.
• Number of pages: 29 pages (typical published edition).

Scope

Specifies transportation and storage conditions for SMDs (both active and passive) to preserve their physical and soldering properties until assembly. Conditions for printed circuit boards are excluded. The standard covers protection against mechanical stress, extremes of temperature and humidity, guidance on packaging types (including dry packing), handling of moisture‑sensitive devices and recommendations to limit exposure times when conditions deviate from the recommended ranges.

Key topics and requirements

• Defined transportation and storage environmental limits (temperature and relative humidity) and recommendations to minimise excursions during transit and warehousing.
• Packaging and packing recommendations to protect against mechanical damage and environmental ingress (including tape/reel, trays, magazines and sealed/dry packaging).
• Moisture‑sensitive device (MSD) considerations — identification, dry packing, labelling and handling advice and cross‑references to established MSD standards and practices.
• Recommendations to avoid assembly failures related to transport/storage (e.g., popcorning, delamination and loss of solderability) and actions to take when devices have been exposed to non‑conforming conditions (e.g., baking/drying procedures).
• Cross‑references and normative references to related IEC and industry documents (for packaging, tape/reel standards and moisture handling procedures).

Typical use and users

Used by component manufacturers, packaging engineers, procurement and logistics teams, PCB assembly and contract manufacturers, quality and reliability engineers, test laboratories and standards/technical committees working on SMD processing and handling. It is a practical reference for specifying shipment/storage requirements in supplier contracts, incoming inspection procedures and production floor handling rules.

Related standards

Closely related documents in the Surface Mounting Technology series and other referenced publications include: IEC 61760-1 (standard method for specification of SMDs), IEC 61760-3 (component specification and labelling methods), IEC 61760-4 (classification, packaging and handling of moisture sensitive devices), the IEC 60286 series (packaging of components on reels and trays) and industry guidance such as IPC/JEDEC J‑STD‑033 for dry packing and handling of moisture sensitive devices. These documents are commonly used together when preparing component specifications and packaging/handling requirements.

Keywords

Surface mounting technology, SMD, transportation, storage, packaging, moisture‑sensitive devices, dry packing, popcorning, IEC 61760, TC 91, tape and reel, handling, logistics.

FAQ

Q: What is this standard?

A: IEC 61760-2:2021 is the part of the IEC surface mounting technology series that gives guidance on transportation and storage conditions for surface mounting devices to preserve their processability and reliability during handling and assembly.

Q: What does it cover?

A: It covers environmental limits, packaging and packing recommendations, mechanical protection, handling of moisture‑sensitive devices, and corrective actions (for example drying) when devices have been exposed to unsuitable conditions. It also cross‑references other IEC and industry documents for specific packaging and MSD procedures.

Q: Who typically uses it?

A: Component manufacturers, electronics assemblers (EMS), procurement/logistics teams, QA/reliability engineers, and test laboratories use this standard to define and verify transport and storage practices for SMDs.

Q: Is it current or superseded?

A: IEC 61760-2:2021 (Edition 3.0) is the current edition published in 2021; it replaces earlier editions (for example the 2007 edition). National and regional adoptions exist (EN IEC and national standards bodies).

Q: Is it part of a series?

A: Yes — it is part of the IEC 61760 series (Surface mounting technology), which includes parts addressing component specification, labelling, MSD classification/packaging and related methods (e.g., IEC 61760-1, -3 and -4). The series is maintained by IEC TC 91 (Electronics assembly technology).

Q: What are the key keywords?

A: SMD, transportation, storage, packaging, moisture sensitive, dry packing, popcorning, tape and reel, IEC 61760.