IEC 62137-3-2011 PDF

Full title and description

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints. This international standard provides a systematic methodology to select appropriate environmental and endurance (reliability) test methods for solder joints used in electronic assemblies, covering a range of device types (surface-mount, area-array, leaded and lead-insertion) and solder alloys.

Abstract

IEC 62137-3:2011 describes a selection procedure that maps real-world stresses and failure modes to accelerated and endurance test methods for solder joints. It supports assessment of joint durability under thermal, mechanical and environmental stresses and gives guidance tailored to device shape, termination type and solder alloy (including lead-free solders). This edition cancels and replaces IEC/PAS 62137-3:2008 and contains editorial revisions but no technical changes.

General information

• Status: International Standard (published and adopted as EN version in regional systems).
• Publication date: 8 November 2011.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.190 (Electronics assembly technology / Quality assurance and reliability of electronic assemblies).
• Edition / version: Edition 1.0 (2011).
• Number of pages: 90 (IEC published edition).

Scope

The standard provides guidance for selecting environmental and endurance test methods to evaluate the reliability of solder joints in assembled electronic devices. It addresses solder joints for surface-mount devices (including area-array types), leaded devices and lead-insertion devices, and considers variations in joint geometry, terminal/lead shape, board mounting and solder alloy (notably lead-free vs tin-lead). The tests and selection logic are intended to assess joint durability on a mounted device rather than the mechanical strength of the component itself. The document replaces the earlier IEC/PAS 62137-3:2008 and was later adopted identically in regional versions (EN 62137-3:2012 and national adoptions/translations).

Key topics and requirements

• Structured test-selection methodology linking field stresses and failure mechanisms to appropriate accelerated/environmental/endurance tests.
• Considerations for device geometry and termination type (SMD shapes, area-array, leaded, lead-insertion) when choosing test methods.
• Guidance on solder alloy influences — especially lead-free solder behaviour versus eutectic or near-eutectic tin-lead alloys.
• Definitions and test parameter notes for common mechanical measures (pull strength, shear strength, torque-shear) relevant to joint assessment.
• Recommended accelerated conditioning methods (temperature cycling, thermal shock, damp heat, mechanical stress tests) and their applicability to different joint types and failure modes.
• Advice on specimen preparation, mounting conditions and interpretation of endurance test results in a reliability-assurance context.

Typical use and users

Used by electronics design and assembly engineers, reliability/test engineers, manufacturing quality teams, qualification laboratories and standards bodies to: select and justify endurance and environmental tests for product qualification, compare the likely effects of solder alloy and termination shape on joint durability, and to design test plans for new assemblies or design changes. Test houses and certification bodies that perform solder-joint reliability testing also routinely apply the guidance.

Related standards

IEC/PAS 62137-3:2008 (replaced by IEC 62137-3:2011); EN 62137-3:2012 (identical/adopted regional version); related parts in the IEC 62137 series covering specific test methods (for example IEC 62137-1-2 series parts on shear strength and other specific endurance test methods, and IEC 62137-4 for area-array package endurance methods). National adoptions and equivalents include JIS C 62137-3 and DIN/EN versions.

Keywords

solder joint, electronics assembly technology, endurance testing, environmental testing, reliability testing, SMD, area-array, leaded device, lead-free solder, test selection, thermal cycling, shear strength, pull strength, torque shear, IEC 62137-3.

FAQ

Q: What is this standard?

A: IEC 62137-3:2011 is an international standard that provides guidance for selecting environmental and endurance test methods to evaluate the reliability of solder joints in electronic assemblies.

Q: What does it cover?

A: It covers a test-selection methodology that maps field stresses and failure modes to appropriate accelerated and endurance test methods for solder joints on various device types (SMD, area-array, leaded and lead-insertion) and for different solder alloys, including considerations specific to lead-free solders.

Q: Who typically uses it?

A: Electronics design and assembly engineers, reliability and test engineers, manufacturing quality teams, independent test laboratories and certification bodies use this standard to design, select or justify solder-joint endurance and environmental test programs.

Q: Is it current or superseded?

A: IEC 62137-3:2011 replaced IEC/PAS 62137-3:2008. The 2011 edition is the published international standard (with regional/EN adoption in 2012) and was listed by the IEC with stability to 2027. Users should check for any amendments or later editions beyond 2011 before applying the standard.

Q: Is it part of a series?

A: Yes — it belongs to the IEC 62137 family (electronics assembly technology / surface-mount and solder-joint testing) which includes multiple parts addressing specific test methods and device classes (for example parts covering shear tests and area-array endurance tests). Regional and national versions (EN, JIS, DIN, etc.) often mirror the IEC text.

Q: What are the key keywords?

A: Solder joint reliability, environmental testing, endurance testing, solder alloys (lead-free), surface-mount devices (SMD), area-array, test selection, thermal cycling, shear/pull strength.