IEC 62326-4-1996 PDF

Full title and description

St IEC 62326-4-1996 — Printed boards — Part 4: Rigid multilayer printed boards with interlayer connections — Sectional specification. This sectional specification provides additional, product‑specific requirements to supplement the generic specification (IEC 62326‑1) for rigid multilayer printed circuit boards and is intended as the basis for agreements between manufacturer and user and for acceptance under the IECQ system.

Abstract

Specifies uniform characteristics, test methods and acceptance requirements for rigid multilayer printed boards with interlayer connections. It identifies the characteristics to be assessed, the tests to be applied and the requirements for quality conformance and for making capability/acceptance agreements between suppliers and purchasers.

General information

• Status: Published (international standard / sectional specification).
• Publication date: 19 December 1996.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.180 (Printed circuits and boards).
• Edition / version: Edition 1.0 (1996).
• Number of pages: 75 pages (base publication).

Scope

This standard applies to rigid multilayer printed boards irrespective of method of manufacture. It is intended to supplement the Generic Specification (IEC 62326‑1) by providing sectional, product‑specific requirements for boards with interlayer connections, and to establish the test methods and acceptance criteria used when printed boards are accepted under IECQ or equivalent quality/acceptance schemes.

Key topics and requirements

• Definition of characteristics to be assessed on rigid multilayer boards (mechanical, dimensional, electrical and porosity-related properties).
• Specified test methods and test specimen descriptions for interlayer connections and multilayer construction.
• Acceptance criteria and uniform requirements to be used in supplier–user agreements and IECQ acceptance.
• Requirements that supplement the generic requirements of IEC 62326‑1 for this product family.
• Reference to capability testing and, where applicable, performance levels and capability qualification (see related Capability Detail Specification, IEC 62326‑4‑1).

Typical use and users

Used by printed circuit board manufacturers, procurement and quality engineers, test laboratories, certification bodies (including IECQ) and design engineers who need product‑specific acceptance criteria for rigid multilayer boards with interlayer connections. The document is applied when establishing technical purchase specifications, qualification testing and capability approval procedures.

Related standards

Closely related to IEC 62326‑1 (Generic specification). Also associated with the sectional capability/detail document IEC 62326‑4‑1 (Capability detail specification — Performance levels A, B and C) and with complementary test and material standards such as applicable parts of the IEC 61189 and IEC 61249 series that cover test methods and base materials.

Keywords

Printed boards; rigid multilayer; interlayer connections; sectional specification; IECQ; capability qualification; test methods; acceptance criteria; PCB quality; performance levels.

FAQ

Q: What is this standard?

A: An IEC sectional specification (Part 4 of the IEC 62326 series) that defines requirements, tests and acceptance criteria specifically for rigid multilayer printed circuit boards with interlayer connections.

Q: What does it cover?

A: Characteristics to be assessed on rigid multilayer boards, the test methods to be used, and the acceptance requirements to be applied when boards are supplied or accepted (including use under IECQ schemes).

Q: Who typically uses it?

A: PCB manufacturers, quality and procurement engineers, test laboratories, certifying/acceptance bodies and design teams involved with multilayer PCB production and procurement.

Q: Is it current or superseded?

A: The document was published on 19 December 1996 as edition 1.0. It is listed as the base IEC publication for Part 4 and has parallel/adopted regional publications (for example EN/BS equivalents published in 1997). Users should check national or IEC catalogues for any amendments, later editions or replacement publications before relying on it for current compliance decisions.

Q: Is it part of a series?

A: Yes — IEC 62326 is a multi‑part series for printed boards; Part 1 is the generic specification and Part 4 (this document) covers rigid multilayer boards with interlayer connections; Part 4‑1 provides capability/detail specification and performance levels.

Q: What are the key keywords?

A: Rigid multilayer printed boards, interlayer connections, test methods, acceptance criteria, IECQ, capability qualification, IEC 62326.