IEC TR 62258-3-2010 PDF

Full title and description

IEC TR 62258-3:2010 (Edition 2.0) — Semiconductor die products — Part 3: Recommendations for good practice in handling, packing and storage. This technical report provides industry guidance and suggested good practices for the handling, packing, transport and storage of semiconductor die products (wafers, singulated bare die, die with attached connection structures, and minimally or partially encapsulated die and wafers) across the supply chain, from wafer fabrication through final assembly and long-term die banking.

Abstract

IEC TR 62258-3:2010 collects established industry experience and practical recommendations to reduce damage, contamination and quality loss of semiconductor die products during processing, handling, packing and storage. Topics addressed include safe manual and automated handling, singulation and thinning issues, ESD and contamination control, packing media and reusable packaging, traceability, guidelines for long-term storage (die banking), and special requirements for optical and microwave die. Annexes provide a planning checklist and material specifications to assist implementers.

General information

• Status: Current (Technical Report).
• Publication date: 6 August 2010 (Edition 2.0).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.080.99 (Other semiconductor devices).
• Edition / version: Edition 2.0 (2010).
• Number of pages: 109 pages.

Scope

This technical report is intended to facilitate the production, supply and use of semiconductor die products by providing suggested good practices for their handling, packing and storage. It covers wafers and singulated die, die with connection structures, and minimally or partially encapsulated products. The report is applicable to manufacturing, transport, intermediate storage and assembly environments, and is intended to help organisations set up, audit or improve facilities and processes that handle bare die products.

Key topics and requirements

• Good-practice procedures for manual and automated handling to minimise mechanical, particulate and contamination damage.
• ESD (electrostatic discharge) control guidelines and recommendations for handling sensitive die and wafers.
• Process issues including wafer thinning, singulation (sawing, scribing, laser cutting, dice-before-grind), and handling of thinned die.
• Special provisions for optical and microwave die where applicable.
• Design and use of transport and storage media: trays, wafer tubs, gel-packs and specialised containers for non-singulated wafers.
• Packing materials, packing methods, reuse and sacrificial packing concepts to protect surfaces and bond pads.
• Storage best practices including environmental controls, shelf-life considerations and recommendations for long-term die banking.
• Traceability and labelling practices to support quality control and lot management.
• Guidance for automated handling during assembly and integration into electronic assemblies.
• Annex guidance: planning checklist (Annex A) and material specifications (Annex B) including adhesive gel tray specifications.

Typical use and users

Primary users include semiconductor manufacturers, die suppliers, electronic assembly houses, test and packaging centres, supply-chain quality and logistics personnel, process and reliability engineers, and auditors establishing or reviewing handling/packing/storage processes. The report is also useful to designers and integrators who incorporate bare die into assemblies for the first time and require practical guidance to minimise yield loss and damage.

Related standards

IEC TR 62258-3 forms part of the IEC 62258 series addressing semiconductor die products. Related documents include IEC 62258-1 (requirements for procurement and use), IEC 62258-2 (exchange data formats), IEC TR 62258-4 (questionnaire for die users and suppliers) and other parts and technical reports in the 62258 family that cover data exchange, XML schemas and supplementary guidance for die product procurement and data formats.

Keywords

Semiconductor die, wafer, bare die, handling, packing, storage, ESD, singulation, wafer thinning, die banking, traceability, packing materials, gel trays, automated handling, die products, TC 47.

FAQ

Q: What is this standard?

A: IEC TR 62258-3:2010 is a Technical Report that provides recommendations and good practices for handling, packing and storing semiconductor die products.

Q: What does it cover?

A: It covers practical guidance on manual and automated handling, ESD control, singulation and thinning processes, transport and storage media, packing materials and reuse, long-term storage (die banking), traceability and planning checklists and material specifications.

Q: Who typically uses it?

A: Semiconductor manufacturers and suppliers, electronic assembly houses, packaging/test facilities, process and reliability engineers, logistics and quality teams, and auditors or integrators working with bare die.

Q: Is it current or superseded?

A: Edition 2.0 was published on 6 August 2010 and is listed as the current Technical Report edition. As of 26 February 2026 it remains the active edition; IEC records a stability/confirmation timeframe for related documents into the 2020s, so users should check IEC national bodies for any later revisions after 2010 if absolute current status is required.

Q: Is it part of a series?

A: Yes — it is Part 3 of the IEC 62258 series on semiconductor die products and is intended to be used alongside other parts (for example Parts 1 and 2 and related TRs) that address procurement data, exchange formats and supplementary guidance.

Q: What are the key keywords?

A: Semiconductor die, wafer, handling, packing, storage, ESD, singulation, die banking, traceability, packing materials, gel tray.