Moldova standards PDF

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires. IEC 60172-2015-05(en-fr). Original standard IEC 60172-2015 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60172-2020

Mechanical standardization of semiconductor devices - Part 6-13- Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA). IEC 60191-6-13-2007. Original standard IEC 60191-6-13-2007 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60191-6-13-2016

Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests. CEI/IEC 60193-1999. Original standard IEC 60193-1999 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60193-2019

Printed boards design, manufacture and assembly - Vocabulary - Part 2- Common usage in electronic technologies as well as printed board and electronic assembly technologies. IEC 60194-2-2017-12(en). Original standard IEC 60194-2-2017 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60194-2-2025

Printed board design, manufacture and assembly - Terms and definitions. Original standard IEC 60194-2015 in PDF full version. Additional info + preview on request

Document status: Replaced by

Dimensions of the crimp area of machined crimp type contacts. Original standard IEC 60203-1966 in PDF full version. Additional info + preview on request

Document status: Withdrawn