JEP95 Design Registration 4.14 Issue J.01-2019 PDF
Name in English:
St JEP95 Design Registration 4.14 Issue J.01-2019
Name in Russian:
Ст JEP95 Design Registration 4.14 Issue J.01-2019
Description in English:
Ball Grid Array Package — Ball Pitch = 0.92, 1.00, 1.27 and 1.50 mm (BGA). Original document JEP95 Design Registration 4.14 Issue J.01-2019 in PDF full version. Additional info + preview on request
Description in Russian:
Корпус с матрицей шариковых контактов (BGA)- шаг 0,92; 1,00; 1,27 и 1,50 мм. Оригинальный документ JEP95 Design Registration 4.14 Issue J.01-2019 в PDF полная версия. Дополнительная инфо + превью по запросу
Document status:
Active
Format:
Electronic (PDF)
Page count:
34
Delivery time (for English version):
1 business day
Delivery time (for Russian version):
3 business days
SKU:
Stjedec000624
More technical details are being prepared for this document.