JEP95 Design Registration 4.27 Issue F.01-2018 PDF
Name in English:
St JEP95 Design Registration 4.27 Issue F.01-2018
Name in Russian:
Ст JEP95 Design Registration 4.27 Issue F.01-2018
Description in English:
Ball Grid Array Package — Ball Pitch = 0.65, 0.75 and 0.80 mm; Body Sizes > 21 mm (BGA). Original document JEP95 Design Registration 4.27 Issue F.01-2018 in PDF full version. Additional info + preview on request
Description in Russian:
Корпус с матрицей шариковых контактов (BGA)- шаг 0,65; 0,75 и 0,80 мм, размеры корпуса более 21 мм. Оригинальный документ JEP95 Design Registration 4.27 Issue F.01-2018 в PDF полная версия. Дополнительная инфо + превью по запросу
Document status:
Active
Format:
Electronic (PDF)
Page count:
25
Delivery time (for English version):
1 business day
Delivery time (for Russian version):
3 business days
SKU:
Stjedec000627
More technical details are being prepared for this document.