JEP95 Design Registration 4.5 Issue O-2023 PDF
Name in English:
St JEP95 Design Registration 4.5 Issue O-2023
Name in Russian:
Ст JEP95 Design Registration 4.5 Issue O-2023
Description in English:
Ball Grid Array Package — Ball Pitch ≤ 0.80 mm; Body Sizes ≤ 21 mm. Original document JEP95 Design Registration 4.5 Issue O-2023 in PDF full version. Additional info + preview on request
Description in Russian:
Корпус с матрицей шариковых контактов- шаг не более 0,80 мм, размеры корпуса не более 21 мм. Оригинальный документ JEP95 Design Registration 4.5 Issue O-2023 в PDF полная версия. Дополнительная инфо + превью по запросу
Document status:
Active
Format:
Electronic (PDF)
Page count:
30
Delivery time (for English version):
1 business day
Delivery time (for Russian version):
3 business days
SKU:
Stjedec000628
More technical details are being prepared for this document.