Moldova standards PDF

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock. Original standard IEC 60749-10-2002 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-10-2022

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock. Original standard IEC 60749-10-2002 сor1-2003 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-10-2022

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices. Original standard IEC 60749-15-2010 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-15-2020

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation. Original standard IEC 60749-17-2003 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-17-2019

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose). Original standard IEC 60749-18-2002 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-18-2019

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat. Original standard IEC 60749-20-1-2009 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-20-1-2019