Moldova standards PDF

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat. Original standard IEC 60749-20-2008 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-20-2020

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level. Original standard IEC 60749-28-2017 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-28-2022

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing. Original standard IEC 60749-30-2011 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-30-2020

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer. Original standard IEC 60749-37-2008 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-37-2022

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components. Original standard IEC 60749-39-2006 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-39-2021

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test. Original standard IEC 60749-5-2017 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-5-2023