Turkmenistan standards PDF
Mark Legibility. Original standard JEDEC JESD22-B114B-2020 in PDF full version. Additional info + preview on request
Document status: Active
Solder Ball Pull. Original standard JEDEC JESD22-B115A.01-2016 in PDF full version. Additional info + preview on request
Document status: Active
Wire Bond Shear Test Method. Original standard JEDEC JESD22-B116B-2017 in PDF full version. Additional info + preview on request
Document status: Replaced by St JEDEC JESD22-B116C-2026
Wire Bond Shear Test Method. Original standard JEDEC JESD22-B116C-2026 in PDF full version. Additional info + preview on request
Document status: Active
Solder Ball Shear. Original standard JEDEC JESD22-B117B-2014 (Reaffirmed 2020) in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor Wafer and Die Backside External Visual Inspection. Original standard JEDEC JESD22-B118A-2021 in PDF full version. Additional info + preview on request
Document status: Active