Turkmenistan standards PDF

Plastic Bottom Grid Array Ball, 0.80 mm Pitch Rectangular Family Package. Original document JEDEC MO-210S-2025 in PDF full version. Additional info + preview on request

Document status: Active

Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package. Original document JEDEC MO-216H-2024 in PDF full version. Additional info + preview on request

Document status: Active

Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. Original document JEDEC MO-220K.01-2011 in PDF full version. Additional info + preview on request

Document status: Active

Plastic Dual Flatpack, Flat Terminal, Rectangular Family Package. Original document JEDEC MO-293C-2025 in PDF full version. Additional info + preview on request

Document status: Replaced by

STEP models for the 288-contact DDR5 DIMM microelectronic assembly, 0.85 mm pitch. Original document JEDEC MO-329I STEP files in ZIP. Additional info + preview on request

Document status: Active

288 Term DDR5 DIMM, 0.85 mm Pitch, Microelectronic Assembly. Original document JEDEC MO-329J-2025 in PDF. Additional info + preview on request

Document status: Active