Turkmenistan standards PDF

Plastic Multi Small Outline, 1.14 mm Pitch, 15.40 mm Body Width, Rect Family Package. Original document JEDEC MO-354B-2024 in PDF full version. Additional info + preview on request

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LPDDR5 CAMM2, 1.38 mm x 1.00 mm Pitch Microelectronic Assembly. Original document JEDEC MO-357E-2025 in PDF full version. Additional info + preview on request

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Plastic Dual Small Outline, Gull Wing, 2.00 mm Pitch, Rectangular Package. Original document JEDEC MO-359B-2024 in PDF full version. Additional info + preview on request

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Plastic Bottom Grid Array Ball, 0.50 mm × 0.70 mm Pitch Rectangular Family Package. Original document JEDEC MO-360A-2024 in PDF full version. Additional info + preview on request

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STEP model for the rectangular silicon bottom-grid column-array package for HBM4. Original document JEDEC MO-362B STEP files in ZIP. Additional info + preview on request

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Silicon Bottom Grid Array, Column, 0.035 mm x 0.055 mm Pitch Rect Package (HBM4). Original document JEDEC MO-362B-2025 in PDF. Additional info + preview on request

Document status: Active