Turkmenistan standards PDF

Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements) (QFN/SON). Original document JEP95 Design Guide 4.8 Issue C-2006 in PDF full version. Additional info + preview on request

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Ball Grid Array Package — Ball Pitch = 0.92, 1.00, 1.27 and 1.50 mm (BGA). Original document JEP95 Design Registration 4.14 Issue J.01-2019 in PDF full version. Additional info + preview on request

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Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP). Original document JEP95 Design Registration 4.22 Issue C.02-2010 in PDF full version. Additional info + preview on request

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Micropillar Grid Array Package — Unencapsulated (MPGA). Original document JEP95 Design Registration 4.26 Issue B-2015 in PDF full version. Additional info + preview on request

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Ball Grid Array Package — Ball Pitch = 0.65, 0.75 and 0.80 mm; Body Sizes > 21 mm (BGA). Original document JEP95 Design Registration 4.27 Issue F.01-2018 in PDF full version. Additional info + preview on request

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Ball Grid Array Package — Ball Pitch ≤ 0.80 mm; Body Sizes ≤ 21 mm. Original document JEP95 Design Registration 4.5 Issue O-2023 in PDF full version. Additional info + preview on request

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