Turkmenistan standards PDF

Characterization of Interfacial Adhesion in Semiconductor Packages. Original document JEDEC JEP167A-2020 in PDF full version. Additional info + preview on request

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Guidelines for Visual Inspection and Control of Flip Chip Type Packages (FCxGA). Original document JEDEC JEP170A-2024 in PDF full version. Additional info + preview on request

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GDDR5 Measurement Procedures. Original document JEDEC JEP171-2014 in PDF full version. Additional info + preview on request

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Discontinuing Use of the Machine Model for Device ESD Qualification. Original document JEDEC JEP172A-2015 (2020) in PDF full version. Additional info + preview on request

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Dynamic ON-Resistance Test Method Guidelines for GaN HEMT based Power Conversion Devices, Version 1.0. Original document JEDEC JEP173-2019 in PDF full version. Additional info + preview on request

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Understanding Electrical Overstress - EOS. Original document JEDEC JEP174-2016 in PDF full version. Additional info + preview on request

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